Product Name: | Mold into the sub |
Materials used: | S-STAR |
Product Size: | Φ45*32.5MM |
EDMmachining tolerances: | 0.003~0.005mm or as required |
Surface roughness of EDM: | Ra0.6 |
Grinding accuracy: | ±0.002MM |
Surface roughness of the grind: | Ra0.2 |
Hardness: | 50-52 |
Delivery time: | 10 days from order placement |
Production Process | Round production → grinding and positioning → fine hole discharge → copper male design and processing → discharge molding → line cutting through hole → quality inspection and testing → packing and shipping |
Mould structure: | Hot work tooling |
Product Applications: | Plastic molds suitable for manufacturing camera bodies, records, lenses and cases. |
How to use: | Extrusion molding |
Product Features: | Corrosion resistant and high hardness steel for plastic molds Medical device molds, cosmetic container molds, food container molds, bottle cap molds, tape box molds Applicable molding resin materials PMMA, PC, EP, PP, PS, PVC, PE, PF, flame retardant added resins, etc. |
5G carries the front, middle and back transmission (access, convergence, core) typical bandwidth requirements relative to 4G increased very significantly, the communication network new construction, equipment expansion, upgrade is imperative, driving the connector to high-speed development.
The future with the deployment of 5G and the large-scale promotion of self-driving cars, telecommunications and data communications connector opportunities are expected to develop rapidly, including high-speed backplane connectors for communications equipment, 400G high-speed data communication interface, high-end RF coaxial connectors, fiber optic connectors and high-speed, highly reliable connector products for 5G infrastructure.
Expected to be driven by 5G, communication connectors are expected to achieve a quantitative price increase, bringing a significant expansion of market space. At the same time data center equipment upgrades will increase the demand for high-performance backplane and mezzanine connectors and power interfaces. The massive increase in data traffic delivery and backhaul will require new high-speed interconnect connectors, including SFP, SFP 28 and QSFP28, as well as fiber patch cords and patch cords.
A. Before sales Service
· 24hour online consult.
· Sample support.
· Detailed technical 2d and 3d drawing design.
· Free pick up at hotel/aitport to visit SENDI factory.
· Quickly and professional response on quotation and technology.
B. Production period service
· Technical 2d and 3d drawing submit to double check details and discussion.
· Quality inspection report submit,guarantee the accuracy.
· Installation solution and maintenance instruction.
C. After sales service
· Provide the usage advice and Guide, remote assistance.
· 16 Years quality Guarantee.
· Any quality problems replace freely.
Dongguan SENDY Precision MOULD Co.,LTD.
Tel/ Phone: +86-13427887793
E- mail: hjr@dgsendy.com
Operational Address: No.1 Tangbei Street, Shatou, Chang'an Town, Dongguan, Guangdong, China.
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